HPCwire, Thursday, December 4th, 2025
Lightmatter Aims To Leapfrog I/O Limitations With 3D Photonic Interconnect
The faster you can move data between processors, the more work you can theoretically get done. This is what's driving innovation in interconnects, for both scale-up as well as scale-out systems. One company that's looking to leapfrog the class is Lightmatter, which is developing a new three-dimensional co-packaged optic (CPO) interconnect that promises big increases in I/O.
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